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***Initial V2 shipments begin late August 2026. Limited launch inventory available***
No Longer Taking Online Orders. ***Request Quote / Contact Us to Order / Approved Purchasers Only***
Cu29 V2 All-Metal Conductive Filament for FDM/FFF 3D Printing
Print Functional Electronics on the 3d Printers You Already Own
All-metal conductivity. High-voltage and high-current capability. No required post-processing. No million-dollar printer required.
Cu29 V2 is an all-metal, conductive filament engineered for power-capable Additive Manufactured Electronics on standard FDM/FFF 3D printers.
Cu29 enables engineers, researchers, and manufacturers to print conductive pathways and electronic structures directly into or onto polymer components using equipment ranging from <$400 desktop printers to $250k+ industrial systems.
Applications include embedded circuits, antennas, sensors, conductive interconnects, EMI/RF shielding, grounding paths, coils, solderable interfaces, and other three-dimensional electronic structures.
Unlike polymer-based conductive filaments, Cu29 contains no polymer binder in the conductive material and requires no sintering, plating, curing, or chemical post-processing after printing.
Cu29 V2 incorporates more than a year of printing, manufacturing, customer feedback, and application development, with significant improvements in printability, extrusion behavior, process consistency, repeatability, and manufacturing scalability.
Choose Your Cu29 V2 Quantity
Select the amount that matches your evaluation, research, or production requirements.
100g – $450 ~ Ideal for initial material evaluation, printer setup, test coupons, and early application development.
250g – $1,000 ~ Designed for larger evaluations, multiple test geometries, and application development.
500g – $1,850 ~ For extended R&D, multiple applications, and higher material utilization.
1kg – $3,500 ~ Best value for advanced development, repeat use, laboratories, and production-oriented programs.
*Material yield varies based on trace width, layer height, geometry, infill strategy, and application. Contact Kupros for an estimated material requirement for your project.
Why Cu29 V2
All-Metal Conductive Performance
Cu29 V2 is a proprietary all-metal conductive filament designed for applications where conventional polymer-based conductive filaments cannot provide sufficient electrical performance.
Published resistivity: 1.226 × 10⁻⁵ Ω·cm
This represents orders-of-magnitude higher conductivity than conventional polymer-filled conductive FDM filaments.
High-Voltage and High-Current Performance
Cu29 is designed for electrical applications beyond the low-current capabilities of conventional polymer-based conductive filaments.
Cu29 has been tested at 12.5 kV, with prior testing at 5 amps. In more recent internal high-current testing, Kupros discharged a supercapacitor bank for 30, 20, 10 and 5 second intervals through a 1.75 mm Cu29 filament sample at 1m, 0.5m, 200mm and 100mm lengths, exceeding the 300-amp measurement limit of the test meter without destroying the filament.
This demonstrates Cu29’s ability to support extremely high transient current loads in addition to conventional low-current electronics applications.
Electrical performance depends on conductor geometry, cross-sectional area, connection method, print parameters, duty cycle, temperature, and application conditions..
No Required Post-Processing
Print the conductive structure and use it.
Cu29 does not require:
• Sintering
• Plating
• Curing
• Chemical processing
• Binder removal
Embedded and Three-Dimensional Electronics
Cu29 conductive features can be manufactured directly into or onto polymer structures, enabling electronics to move beyond traditional flat circuit-board geometries.
Develop applications including:
• Embedded conductive pathways
• Conformal electronic structures
• Flexible and non-planar circuits
• Solderable interfaces
• Integrated sensors
• Printed antennas
• Conductive coils
• EMI/RF structures
Works Across the FDM/FFF Ecosystem
Cu29 has been developed for use across desktop, research, and industrial FDM/FFF equipment.
Validated and tested platforms include systems from manufacturers such as Sovol, Bambu Lab, and industrial additive manufacturing platforms.
Cu29 enables organizations to explore Additive Manufactured Electronics without requiring a dedicated proprietary electronics-printing platform.
Proven by Early Adopters
Cu29 has been purchased or evaluated by organizations across aerospace, defense, national laboratories, academia, research, and advanced manufacturing, including:
• NASA
• Boeing
• Northrop Grumman
• KBR
• U.S. Army DEVCOM Aviation & Missile Center
• U.S. Army DEVCOM Army Research Laboratory
• Los Alamos National Laboratory
• Johns Hopkins Applied Physics Laboratory
• Youngstown State University
• Purdue University Center for In-Space Manufacturing
• nScrypt
Cu29 was also named the 2026 TCT Materials Award winner, recognizing the technology during its first year of pilot availability.
Kupros has additionally shipped Cu29-enabled sensor test articles to Oak Ridge National Laboratory for further evaluation.
Applications
Cu29 is being developed and evaluated for applications including:
Embedded Electronics
Print conductive pathways and electronic structures directly into polymer components.
Antenna and RF test structures
Explore conformal antennas, printed RF geometries, coils, and other three-dimensional conductive architectures.
Sensors and Strain Gauges
Develop surface-integrated and embedded sensing structures directly within FDM/FFF manufactured components.
EMI and RF Shielding
Create conductive geometries for electromagnetic shielding, grounding, and interference-management applications.
Aerospace, Defense, and Space R&D
Support distributed manufacturing, point-of-need electronics, advanced prototyping, sustainment research, and next-generation electronic structures.
Research and Advanced Manufacturing
Develop new conductive geometries and applications without requiring proprietary AME hardware.
Cu29 V2 Specifications
Material: Proprietary all-metal composition, no polymer binder
Form: 1.75 mm filament
Published Resistivity: 1.226 × 10⁻⁵ Ω·cm
Printing Process: FDM/FFF
Recommended Processing Range: 232–260°C
Feature Size: Dependent on nozzle diameter, geometry, and print parameters
Post-Processing: None required for electrical conductivity
Cu29 V2 Launch Availability
Kupros has completed an initial production batch of approximately 90 kilograms of Cu29, with initial V2 shipments beginning late August 2026.
Launch inventory is limited, and a portion of the initial production run is being reserved for customer evaluations, technical validation, quality assurance, application-development programs, and strategic partners.
Orders are open now for late-August delivery. cLICK HERE TO CONTACT US
For organizations evaluating Cu29 for embedded electronics, antennas, sensors, shielding, conductive pathways, coils, interconnects, or another application, contact Kupros before ordering if you would like help determining the right quantity for your project.
For bulk orders, technical evaluations, application development, or enterprise requirements, contact:
May be subject to U.S. export-control laws.
Export-Control Notice
Kupros products, materials, documentation, technical data, software, support, and related information may be subject to U.S. export-control laws, including the Export Administration Regulations, EAR, the International Traffic in Arms Regulations, ITAR, and U.S. sanctions laws.
Until export classification is complete or otherwise confirmed by Kupros, certain products, technical data, support, downloads, and documentation are available only to approved U.S. Persons and U.S. entities.
By requesting a quote, purchase, sample, technical support, documentation, or access to Kupros materials or technical information, you certify that you will not export, reexport, transfer, disclose, release, resell, divert, or provide access to any Kupros product, material, technical data, documentation, software, or support to any foreign person, foreign entity, restricted party, embargoed destination, prohibited end user, or prohibited end use without all required U.S. Government authorizations.
Kupros reserves the right to deny, delay, cancel, or require additional review of any order, quote request, shipment, download, or support request based on export-control, sanctions, end-use, end-user, destination, or diversion concerns.